December 7 - 9, 2010 (Tuesday to Thursday), Singapore
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| For inquiries, please email to liuex@ieee.org |
| Upcoming News: * Call for Paper & Proposal * Paper Submission Portal |
| Call for Papers EDAPS Paper Submission Portal IEEE Copyright & Consent Form Regular Paper Submission Deadline (30 September 2010) |
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The
IEEE Electrical Design of Advanced Packaging & Systems (EDAPS)
has
been
the premier international symposium in Asia region
since it was launched in 2002 in Singapore. Thereafter, it
was
held in Korea in 2003, Japan in 2004, India in 2005, Shanghai China in
2006, Taiwan China in 2007, Korea in 2008, Hong Kong China in 2009.
The symposium consists of paper presentations,
industry exhibitions, workshops and tutorials. The 2010 EDAPS
will be held in Singapore from Dec. 7 to 9, 2010.
The purpose of EDAPS Symposium is to enhance the technical awareness and technology collaborations in the Asia region specifically in the electrical designs of chip, package and system levels from design concepts, technical challenges to the modeling and EDA tools. The papers of the symposium not only address the current technical issues but also bring out the challenges facing to IC design, SiP/SoP packaging, EMI/EMC, and EDA tools and most importantly to address the challenge issues in 3D IC and packaging design issues. The symposium is a major venue for creating the opportunity for the researchers and practitioners from the diverse fields to exchange information and build up the network.
Important Deadlines and Dates
The purpose of EDAPS Symposium is to enhance the technical awareness and technology collaborations in the Asia region specifically in the electrical designs of chip, package and system levels from design concepts, technical challenges to the modeling and EDA tools. The papers of the symposium not only address the current technical issues but also bring out the challenges facing to IC design, SiP/SoP packaging, EMI/EMC, and EDA tools and most importantly to address the challenge issues in 3D IC and packaging design issues. The symposium is a major venue for creating the opportunity for the researchers and practitioners from the diverse fields to exchange information and build up the network.
Important Deadlines and Dates
| Special Session / Workshop / Tutorial Proposal Submission Deadline | July 15, 2010 |
| Special Session / Workshop / Tutorial Proposal Acceptance Notice | July 30, 2010 |
| Regular Paper (4-pages PDF) Submission Deadline | Sept. 30, 2010 |
| Special Session Paper Submission Deadline | Sept. 30, 2010 |
| Regular Paper Acceptance Notice | Oct. 15, 2010 |
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IEEE Society |
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The IEEE Components, Packaging and Manufacturing Technology Society (CPMT) |